| 摘要 |
<p>PURPOSE: To maintain a stable state of the connection of a semiconductor element housing package with an external electric circuit board strongly and extending over a long period by a method wherein the insulating substrate of the package consists of a ceramic sintered body and the thermal expansion coefficient of the ceramic sintered body in a specified temperature range is a numerical value in a specified range. CONSTITUTION: In a semiconductor element housing package A which is packaged on the surface of an external electric circuit board B, an insulating substrate 1 of the package A consists of a ceramic sintered body and the thermal expansion coefficient of the sintered body in a temperature range of 40 to 400 deg.C is 80 to 180×10<-7> / deg.C, exceptionally 90 to 140×10<-7> / deg.C. Thereby, the generation of a thermal stress is relaxed by a thermal expansion coefficient difference between the thermal expansion coefficients of the package A and the circuit board B and the state of the electrical connection of the package A with the circuit board B can be maintained in a good state of extending over a long period. As such the ceramic sintered body having a high thermal expansion coefficient, an Al2 O3 -SiO2 sintered body is mentioned and one containing anα-cristobalite crystalline phase and/or a mullite crystalline phase in a sintered body can be mentioned.</p> |
