| 摘要 |
PURPOSE: To reduce the number of parts items, to improve an assembly working efficiency and to improve the packaging efficiency of a wiring board in an electronic component packaging module. CONSTITUTION: In an electronic component packaging module, an intermediate part 21 formed on the lower side of an outer lead 2 of an acceleration sensor 1 is held in a holding part 31 formed in a printed-wiring board 3. In a region held with this intermediate part 21, when the board 3 and the sensor 1 are mounted to a support body 4 by a clamping member 7, a stress, which is generated by a change in the relative position between the board 3 and the sensor 1, is absorbed in the region. The relative position between a continuity part 32 formed in the board 3 and the point part 22 of the outer lead 2 is not changed even if the change in the relative position between the board 3 and the sensor 1 is generated. There is no generation of a stress between the part 32 and the point part 22 and the continuity failure between the sensor and the board 3 can be prevented from being generated. |
