Resin-encapsulated semiconductor device

摘要

A resin-encapsulated semiconductor which is free from the occurrence of blisters or cracks during soldering, suits for continuous production and has excellent moisture resistance reliability is obtained by using an epoxy resin encapsulating material which comprises (A) an epoxy resin component, (B) a curing agent represented by the following general formula (II), <IMAGE> (II) wherein m is a number of 0 to 30, (C) at least one cure accelerator selected from the group consisting of compounds represented by the following formulae (III) and (IV), <IMAGE> (III) <IMAGE> (IV) (D) a release agent selected from the group consisting of a polyethylene wax or a mixture thereof with carnauba wax and a mixture of a polyethylene wax or a montanic ester wax, and (E) 65 to 90% by volume of fused silica as a filler.