发明名称 |
Process for manufacturing a multi-layer lead frame |
摘要 |
A process for manufacturing a multi-layer lead frame for a semiconductor device comprises two metal plains being adhered to each other via an insulation piece. An insulation strip is punched to cut the insulation piece, which is preliminary adhered to a metal strip. The metal strip is then punched to cut and remove the metal plane, which is then laminated and heat-pressed to another metal strip. After completely adhered, the other metal strip is punched to remove a multi-layer lead frame. |
申请公布号 |
USRE35353(E) |
申请公布日期 |
1996.10.22 |
申请号 |
US19940314311 |
申请日期 |
1994.09.28 |
申请人 |
SHINKO ELECTRIC IND. CO, LTD.;INTEL CORPORATION |
发明人 |
TOKITA, MASAKUNI;KOBAYASHI, AKIRA;YAMAKAWA, SHINICHI;SHIMIZU, MITSUHARU;MASUDA, NORIHIRO |
分类号 |
H01L21/48;H01L23/495;(IPC1-7):B32B31/18;H05K3/36 |
主分类号 |
H01L21/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|