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发明名称
BONDED WAFER
摘要
申请公布号
JPH08279441(A)
申请公布日期
1996.10.22
申请号
JP19950082762
申请日期
1995.04.07
申请人
TOSHIBA CORP
发明人
HORIE MITSUO
分类号
H01L21/02;(IPC1-7):H01L21/02
主分类号
H01L21/02
代理机构
代理人
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地址
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