| 摘要 |
1279699 Semi-conductor devices SEMIKRON GES FUR GLEICHRICHTERBAU UND ELEKTRONIK mbH 3 Dec 1969 [20 Dec 1968] 59000/69 Heading H1K A semi-conductor element 14 is soldered to a metallized area 2 of a thermally conductive ceramic substrate 1 of alumina or beryllia and the assembly then provided with an injection moulded housing 5 of alumina filled plastics which is keyed to ridges la (or, in variants, to grooves) on the substrate. The encapsulation surrounds all but the lower face of the substrate which is a plane surface to be clamped to a heat sink or heat dissipating plate by a spring clip integral with the heat sink or by bolts passing through flanges in the substrate. One electrode system of the diode shown consists of a molybdenum plate 15, a metallic body 16, and a stranded conductor 17; the other electrode system consists of the metallized area 2 to which is joined a ring at the end of a lead 18. In variants (Figs. 1-3, not shown), the substrate is provided with two metallized areas to which respective D.C. connection of a bridge rectifier are connected, and pairs of diodes-one on each area-are connected by the phase leads of the bridge. In a manufacturing method, a ceramic substrate provided with two metallized strips each with diodes mounted along is formed with grooves at its undersurface so that units may be broken off which consist of a portion of each area and a respective diode.
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