| 摘要 |
PURPOSE: To easily, rigidly and electrically connect each electrode with bonding pads by suing short bonding wires which do not cause malfunction to a semiconductor element, by stretching a part of bonding pads on a film for preventing flowing-in whose wetability to a conducting adhesive part member is low. CONSTITUTION: A plurality of bonding pads 8 with which electrodes of a semiconductor element 4 are electrically connected via bonding wires 9 are formed. An insulating frame body 2 and a lid body 3 which are joined to the upper surface of an insulating substrate 1, while surrounding a die pad 6 and the bonding pads 8 are formed. A film 11 for preventing flowing-in whose wetability to a conducting adhesive part member 7 is low is stuck on connection conductor 10 of the insulating substrate 1. A part of the bonding pads 8 is stretched on the film 11. Thereby the conducting adhesive part member 7 is prevented from flowing in the bonding pads 8, and the bonding wires 9 can be made to approach the die pad 6. |
