| 摘要 |
PURPOSE: To provide a method of manufacturing a semiconductor device having the patterning step capable of reusing a key pattern of once used wafer. CONSTITUTION: The manufacturing method is related to a semiconductor device having three steps as follows: the first step of making alignment of a mask 2 formed of an element forming pattern with a wafer 1 coated with a resist 5 making reference to the key pattern 4 provided on the mask 2 and the other key pattern 3 provided on a wafer 1, the second step of irradiating the resist 5 on the wafer 1 with ultraviolet rays through the intermediary of the mask 2, and the third step of developing the wafer 1 for pattering the resist 5. In such a constitution, the width of the key pattern 4 on the mask 2 is made fine in such a degree so that the key pattern 4 on the mask 2 in the irradiation time with ultraviolet rays may not be patterned on the resist 5 on the wafer 1. |
