| 摘要 |
PURPOSE: To rigidly bring a viahole into contact with a board main body, and rigidly solder a metal part member to the board main body, in a ceramic circuit board provided with the board main body having a viahole in which Ag based conductor material is buried and a thin film wiring layer electrically connected with the viahole on the surface of the board main body. CONSTITUTION: In a ceramic circuit board provided with a board main body 11 having a viahole 12 in which Ag based conductor material is buried, and a thin film wiring layer electrically connected with the viahole 12 on the surface of the board main body 11, a metal layer 13 selected out of Cr, Pd and Ni is formed between the viahole 12 and the thin film wiring layer. The thickness of the metal layer 13 is 100-50000Å. A metal part member is soldered to the thin film wiring layer wherein the viahole 12 is covered with the metal layer 13. The gap between the outer peripheral end of the metal layer 13 and that of the viahole 12 is at most 0.1mm.
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