| 摘要 |
PURPOSE: To easily adjust the size and position of a mark put on a defective element by correcting the relative position of the mark in a two-dimensional plane when the position is not appropriate or the relative height of the mark when the size of the mark is not appropriate. CONSTITUTION: A control means 35 which corrects and controls the relative positional relation between the pad electrode of a wafer 1 and probe 3 and overdriving amount of a placing stage 2 based on the recognized result of a recognizing means 30 is provided. The control means 35 is composed of a CPU 33 and ROM 36 which stores various kinds of arithmetic information. The CPU 33 controls the movement of the stage 2 in the X-, Y-, and Z-axis directions andθ-direction by calculating the drive amount of the stage 2. Therefore, an appropriate mark can be accurately put on a defective element for sorting defective elements from defectless elements.
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