| 摘要 |
<p>PURPOSE: To provide a lead frame which can maintain an element mounting part in an adequate position, in a molding process. CONSTITUTION: This lead frame consists of the following; a frame part 1, a semiconductor element mounting part 2 formed in the frame part, a plurality of leads which stretch toward the semiconductor element mounting part from the frame part, and a protruding part 3B. The tip part of at least one of the leads 3 is connected with the semiconductor element mounting part. The protruding part 3B is collectively molded in an unified body with the lead 3A connected with the semiconductor element mounting part, at an altitude exceeding a wire boned to a semiconductor element mounted on the semiconductor element mounting part.</p> |
