| 摘要 |
PURPOSE: To use in common semiconductor devices different in outer terminal connection layout, and reduce ground bounce noise caused by the increase of ground outer terminals of a semiconductor device. CONSTITUTION: The respective electrode terminals of a semiconductor element 1 are connected with mutually independent stitches 3a for signal (or power supply) or a stitch 3b for ground which is formed in a ring type. It can be arbitrarily selected that the electrode terminal is connected with which stitch. The electrode terminal of the semiconductor element 1 which turns to ground is connected with the ring type stitch 3b for ground of a substrate, via a thin metal wire 2, and further connected with a ground plane layer as the lower lower, via a through hole in substrate. The through hole to be connected with the ground plane layer is formed in the vicinity of an outer terminal, and connected on the outer terminal fixing surface of the substrate, via an electric wiring pattern. By the above wiring connection, the outer terminal functions as the ground. |
