| 摘要 |
PURPOSE: To provide a semiconductor component wherein, while electric characteristics (signal delay or the like) of a passing signal and heat dissipating property from a semiconductor chip are maintained, a large-sized chip can be mounted, generation of chip exfoliation and chip crack which are to be caused by moisture absorption and thermal cycling is prevented, and reliability is remarkably improved. CONSTITUTION: A printed circuit board 2 as a signal wiring layer is joined to a heat sink 1 made of ceramics which is constituted of an aluminum nitride substrate or silicon nitride substrate. Leads 3 made of copper, e.g., are connected with the signal wiring layer. A semiconductor chip 4 is joined and mounted on the heat sink 1, and electrically connected with the signal wiring layer constituted of the printed circuit board 2, through bonding wires 5 or the like. |
