SEMICONDUCTOR SUBSTRATE CLEANING DEVICE, CLEANING METHOD AND FORMATION OF CLEANING LIQUID

摘要

PURPOSE: To provide a cleaning device, which can remove organic and metallic impurities on the surfaces if wafers without using a chemical liquid and ultrapure water in large quantities, a method of cleaning the wafers and a method of forming a cleaning liquid and to contrive to reduce the production cost of a semiconductor device and an environmental load. CONSTITUTION: Pure water is put in a cleaning tank 6 consisting of a PEEK material through a pure water feed opening 2, Cl2 is bubbled in the pure water through a Cl2 feed opening 1A, a cleaning liquid containing chlorine ions, hypochlorous acid ions and chloric acid ions is formed and wafers 5 are made to immerse in this cleaning liquid and are cleaned.