发明名称 WAFER DETECTION DEVICE
摘要 <p>PURPOSE: To provide a wafer detection device which can detect all kinds of wafers having different reflectivity though the device can be manufactured at a low cost and fitted and adjusted easily and, at the same time, which is surely prevented from making false detection due to dropping wafers. CONSTITUTION: A reflection beam sensor 60 whose sensitivity is adjusted to a low-reflectivity wafer with a substantially long detecting distance L is used and a detecting beam transmitting window 62 is provided through the bottom plate 52A of a chamber 52 at the position corresponding to the sensor 60 so that a detection beam LB reaching the bottom 52B of the chamber 52 cannot be transmitted through the window 62 when no wafer W exists at a detecting position. At the same time, a projection 64 is provided near the window 62 as a wafer supporting section to support a wafer W dropping onto the bottom 52B of the chamber 52 in an inclined state so that a reflected beam LB1 from the wafer W can be directed away from the sensor 60.</p>
申请公布号 JPH08274145(A) 申请公布日期 1996.10.18
申请号 JP19950074145 申请日期 1995.03.30
申请人 TOSHIBA MACH CO LTD 发明人 SUGIYAMA HISATAKA;HAYASHI SHINGO;OMURA NOBUHISA
分类号 G01V8/12;G01N21/88;G01N21/956;H01L21/67;H01L21/68;(IPC1-7):H01L21/68 主分类号 G01V8/12
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