| 摘要 |
<p>PURPOSE: To provide an LOC type semiconductor device wherein an insulating tape or a chip pad is not used, and obtain a semiconductor device wherein internal temperature distribution is reduced, deformation is restrained, and thinning is enabled. CONSTITUTION: Inner leads 2 are brought into contact with the circuit forming surface 1a of a semiconductor element 1, directly or via sealing resin, and connected with electrode pads 3 through thin metal wires 4. These are sealed with resin. At the time of manufacturing a semiconductor device, the circuit forming surface 1a of the semiconductor element 1 is turned downward to the lead, and resin sealing is performed. Thereby crack of the semiconductor element and the sealing resin which is to be caused by the conventional insulating tape is not generated. Since the difference of coefficient of linear expansion between the semiconductor device and a circuit board does not increase, fatigue breakdown is not generated. Since the loop height of a bonding wire can be reduced, wire flow can be prevented, and the device can be thinned. The part member of the main surface of the semiconductor element is practically identical, so that the temperature distribution is little, and deformation of the semiconductor device is reduced.</p> |
