| 摘要 |
PURPOSE: To reduce the failure due to deformation in the course of manufactur ing process, and enable excellent electric connection with a socket, in the case of test or burn-in, by forming an outer lead in the hole of a recess formed in a package, which outer lead connects a semiconductor chip with an external terminal and outputs and inputs a signal. CONSTITUTION: In a semiconductor package 1, a semiconductor chip 3 is electrically connected with a package 5 through bonding wires 7, which are electrically connected with holes 9 having recessed forms. Inside the recessed holes 9, an outer lead part is formed which turns to a connection part of the semiconductor package 1 and outer terminals. By connecting the holes 9 with external terminals, the semiconductor chip 3 can input and output a signal to and from the outside through the bonding wires. Thereby the failure due to deformation like the bending of a pin in the course of manufacturing process can be reduced. The joining quality to an outer terminal can be improved. |
