| 摘要 |
PURPOSE: To provide a new connecting method, which can perform adequate wire bonding even when an output pad is arranged at a part other than surrounding part of a chip for connecting the output pad on an integrated circuit chip and a multi-chip module formed by this method. CONSTITUTION: A first bonding pad 24, wherein a chip is fixed to a substrate at the lower surface of the chip, at least one wire bonding adaptor is used and the upper surface thereof is formed along a first edge 26, a second bonding pad 28, whose upper surface is formed along a second edge 30, and an electric connector 32 between the first and second bonding pads are provided. Bonding wires 34 and 36 are connected between the output pad of the line and the first bonding pad at the one side and connected between the second bonding pad and the conducting pad on the substrate on the other side. |
