MULTILAYER PRINTED INTERCONNECTION BOARD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: To provide a manufacturing method of a multilayer printed interconnection board according to which it can be made without shifting or deforming inner layers and prepregs laminated on the parallel arranged inner layers together with Cu foils laminated thereon even when they are hot pressure formed. CONSTITUTION: A multilayer printed circuit board is made by arranging inner layers in parallel which have formed inner layer circuits, laminating prepregs and Cu foils on the inner layers and hot pressure forming them, using resin having a minimum melt viscosity of 10000-20000 poises at a temp. rise rate of 2-3 deg.C/min and melt viscosity of 60000 poises or more after 20min from the time at which it reveals a minimum melt viscosity for the prepregs located between the inner layers and Cu foils.