| 摘要 |
PURPOSE: To shield α-ray to the whole part of a circuit forming region, and reduce the stray capacity between a semiconductor chip and inner leads. CONSTITUTION: A plurality of inner leads 3A are bonded on the circuit forming surface of a semiconductor chip 1 by using adhesive agent 7, interposing insulator 4B for electric insulation from the semiconductor chip. The inner leads 3A are electrically connected with the semiconductor chip 1 through bonding wires 5. These are sealed with resin. In this semiconductor device, a passivation film covering the circuit forming surface has a polyimide film 8 for shielding α-ray. An insulating film is partially formed in the part where at least the tips of the inner leads and/or suspension leads are bonded to the semiconductor chip. α-ray to the whole part of the circuit forming region can be shielded by the polyimide film 8 for shielding α-ray, and the semiconductor chip can be bonded and fixed by the insulating film. |
