| 摘要 |
PURPOSE: To provide power feed structure capable of suppressing voltage drop and heat generation in a printed board or a power feed bus, which increase with high speed operation of electronic equipment, without increasing the number of power source layers in the printed board by improving the arrangement of a power feed pad on a printed board, structure of the power feed bus, and connecting structure of the power feed bus to the printed board. CONSTITUTION: Electronic equipment has a printed board 3 on which a plurality of LSI modules (example: 1 and 2) are mounted, and constituted with a power feed pad 10 of a plurality of kinds of power sources dispersed and arranged in peripheral positions of LSI modules 1, 2 of the printed board 3, a power feed block 11 for fixing power feed buses 4, 5 mounted on the power feed pad 10, and power feed buses 4, 5 fixed to the power feed block 11. Power is supplied to the printed board 3 from power sources 6, 7 and 8, 9 through the power feed buses 4, 5, the power feed block 11, and the feed pad 10. |
