| 发明名称 |
PREPARATION OF ELECTRONIC CIRCUIT,SEMICONDUCTOR MATERIAL WAFER AND INTEGRATED CIRCUIT |
| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a new manufacturing method of an electronic circuit, which can recognize defective circuit simply, economically and quickly in the electric inspection. SOLUTION: On a semiconductor substrate 1, an electronic circuit and electric connecting lines 12 used for the diagnosis purpose are integrated on the semiconductor substrate 1 under the regulary separated pattern by scribing lines 11 in the single structure.</p> |
| 申请公布号 |
JPH08274135(A) |
申请公布日期 |
1996.10.18 |
| 申请号 |
JP19950234274 |
申请日期 |
1995.09.12 |
| 申请人 |
SGS THOMSON MICROELETTRONICA SPA |
发明人 |
BURUUNO MURAARI;ROBERUTO TOSUKAANI;FUABIO MARUKIO;SANDORO SUTORUTEI |
| 分类号 |
H01L21/66;G01R31/28;H01L21/822;H01L23/58;H01L27/02;H01L27/04;H05K1/02;H05K1/03;H05K3/00;(IPC1-7):H01L21/66 |
主分类号 |
H01L21/66 |
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