| 摘要 |
PURPOSE: To obtain a multilayer ceramic board having neither protrudent parts of series via-hole parts nor irregularities on the surface wherein these via-holes pierce a pluralities of layers at the same positions. CONSTITUTION: Conical or square conical via-holes are formed at the same positions of green sheets 1a-1d and charged with a conductor from smaller apertures thereof to form via-holes with leaving spaces not charged with the conductor at the larger apertures. The conductor is charged in only a part of the via-hole. A via-hole part land pattern is formed on only the periphery of the via-hole. By using green sheets having via-holes only, one layer is formed with a pair of the sheets to expand the volume of the via-hole. The size of the via-hole is made larger than a required size. The green sheets worked by these methods are laminated, pressure-welded and backed to form superimposed series via-holes on a straight line. |
