发明名称 Leistungshalbleitermodul
摘要 A power semiconductor module includes a housing having a baseplate, on which at least one power semiconductor switching element is arranged, the power semiconductor switching element having at least two power electrodes connected to corresponding power connections, the power connections extending parallel to the base plate and passing out of the housing parallel to the base plate, thereby extending above one another in a plurality of planes and being connected to the corresponding power electrodes of the power semiconductor switching element by connecting wires, the power semiconductor module including a plurality of control and auxiliary connections wherein the control and auxiliary connections are passed out of the housing at right angles to the base plate and the control and auxiliary connections are designed for plugging into the control unit driving the module, and the power semiconductor module including fastening mechanisms provided on the housing and fixing the control unit on the housing of the module.
申请公布号 DE19529785(A1) 申请公布日期 1996.10.17
申请号 DE1995129785 申请日期 1995.08.12
申请人 ABB MANAGEMENT AG, BADEN, AARGAU, CH 发明人 STOCKMEIER, THOMAS, DR., RANCHO PALOS VERDES, CALIF., US;THIEMANN, UWE, DR., RANCHO PALOS VERDES, CALIF., US;BAYERER, REINHOLD, DR., CHULA VISTA, CALIF., US
分类号 H01L25/07;H01L25/18 主分类号 H01L25/07
代理机构 代理人
主权项
地址