| 摘要 |
In order to prevent bleed and flash in the extrusion coating of a semiconductor chip (3) fitted on a lead frame (1) pressure pads (9) are provided in one of two casting mould halves (6, 8) in such a way that the free ends of the lead frame contacts (1, 1a) are pressed by one mould half (8) against the other (6). The holes thus made in the plastic material (4) surrounding the semiconductor chip (3) are advantageously filled with adhesive. |
