Power semiconductor module

摘要

The module has a housing and a metal base carrying electrically and thermally insulating substrates with conducting tracks and six adjacent controllable power semiconductor switches (1-6), each attached to one track and electrically connected to it. Load current connections are connected to the housing wall. Bonding areas (35-43) on the underside of the substrate are connected to the switches via bonding wires. At least one additional conducting track (30-32) is provided for each two adjacent switches. Each additional track is connected via bonding wires to one of the bonding surfaces and/or to at least one of the adjacent switches and/or to the additional track of the adjacent two switches. There are at least six load current connections with six bonding surfaces. The conducting tracks of two adjacent switches can be directly connected via bonding wires.