| 摘要 |
PCT No. PCT/EP96/01311 Sec. 371 Date Nov. 10, 1997 Sec. 102(e) Date Nov. 10, 1997 PCT Filed Mar. 25, 1996 PCT Pub. No. WO96/31109 PCT Pub. Date Oct. 3, 1996Disclosed is a device for separating components (3, 20), in particular electronic components which are connected to a support such as a circuit board (1) by a fixing material such as solder and can be lifted from the support with the aid of a gripping element (17) under a preloaded force acting in the direction in which the components (3, 20) are to be lifted from the support. A lifting device (13) connected to the gripping element (17) causes the preloaded force to become effective when the fixing material reaches its melting temperature. The lifting device (17) is provided with a retaining member (9, 25, 31, 33) whose melting temperature is equal to or higher than that of the fixing material and which triggers the action of lifting the component (3, 20) when the fusible material melts. |
