发明名称 Method for mounting components and an apparatus therefor
摘要 The present invention relates to a method for mounting a component at a specific position, preferably on a substrate such as a printed circuit board, by means of attracting the components through an attracting nozzle from a component supply unit, transferring the component and mounting same at the desired position. Said method is improved in that by detecting the projection width of the component rotating in a X-Y-plane through a predetermined angle of rotation about it's vertical axis a normal attracting position of the component is discriminated and correcting amounts of the component's mounting position with respect to the rotational position and one of the longitudinal positions of the component in direction of the X-axis or Y-axis are measured while a correcting amount of the other longitudinal position is calculated on the basis of the correcting amounts. <IMAGE>
申请公布号 EP0577128(B1) 申请公布日期 1996.10.16
申请号 EP19930110535 申请日期 1993.07.01
申请人 YAMAHA HATSUDOKI KABUSHIKI KAISHA 发明人 SAKURAI, HIROSHI;OHTA, HIROYUKI;ONODERA, HITOSHI
分类号 G01B11/00;G01B11/24;G06T1/00;H01L21/68;H05K13/04;H05K13/08;(IPC1-7):H05K13/08;H01L21/00 主分类号 G01B11/00
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