| 摘要 |
A coil plate assembly having a pair of coil plates with an electrical coil interposed therebetween to position the coil in a molding die for encapsulation in an insulating material. The coil plates each have a pair of side shrouds extending alongside the coil and a boss is formed on the remote end of each shroud. A terminal clasp encircles each pair of bosses of adjacent shrouds to connect the shrouds of the two plates together. In addition, the terminal clasps are electrically connected to the coil and extend outward from the coil plates to act as terminals for making connection in a circuit.
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