MOUNT SYSTEM OF CHIP PARTS

摘要

a slantly mounted induction mirror (42); a semi-transparent reflection mirror (44) inclined at the angle opposing the induction mirror (42); a reflection mirror (43); a head driver base (60); a mirror box (41) mounted on the head driver base (60) and internally provided with the induction mirror (42), reflection mirror (43) and semi-transparent reflection mirror (44); high and low magnification CCD cameras (45)(46) adapted to be downwardly mounted over the semi-transparent reflection mirror (44) and the reflection mirror (43) to recognize the reflected object of a chip element, the CCD cameras (45)(46) being disposed in a chip element position recognizing section (D) between a suction position section (A) and a corrected position section (B).