| 发明名称 |
Semiconductor device and process for production thereof |
| 摘要 |
A semiconductor device having an interconnecting line formed of aluminum containing a predetermined additive element, wherein a segregate layer of the additive element is formed along aluminum grain boundaries in the interconnecting line on the basis of a heat treatment after the formation of the interconnecting line.
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| 申请公布号 |
US5565380(A) |
申请公布日期 |
1996.10.15 |
| 申请号 |
US19930172716 |
申请日期 |
1993.12.27 |
| 申请人 |
KAWASAKI STEEL CORPORATION |
发明人 |
NEMOTO, TAKENAO;NOGAMI, TAKESHI;MATSUKAWA, NAOKI |
| 分类号 |
H01L21/768;H01L23/532;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/768 |
| 代理机构 |
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