发明名称
摘要 PURPOSE:To easily and rapidly cut an unexposed part by cutting away at least a part of the unexposed part by using a cutter heated to >=60 deg.C prior to removal of the unexposed part by dissolution. CONSTITUTION:A printing plate material constituted of a photosensitive resin layer and base is subjected to the exposing for image formation according to the conventional method. The exposed part of the photosensitive resin layer is insolubilized by this exposing and, therefore, the unexposed part is dissolved away by a suitable solvent. At least a part of the unexposed part is cut away prior to the stage for dissolving away the unexposed part by the solvent. The cutting is executed by using the cutter heated to >=60 deg.C. The cutting of the unexposed part to be executed prior to development is thereby easily executed.
申请公布号 JP2544415(B2) 申请公布日期 1996.10.16
申请号 JP19870301773 申请日期 1987.11.30
申请人 TOKYO OHKA KOGYO CO LTD 发明人 SHIMIZU TAKAAKI;KATO KAZUO
分类号 G03F7/38;G03C5/00;G03F7/00;(IPC1-7):G03F7/38 主分类号 G03F7/38
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