发明名称 |
Producing system of printed circuit board and method therefor |
摘要 |
An assembly line includes a printing device for printing solder on a land of a circuit board, a mounting device for mounting an electric component at a predetermined position of the solder, and a soldering device for soldering the land to a terminal of the component. A monitored items detecting device detects predetermined to be monitored items of the board and equipment used in the printing, mounting, or soldering devices, and a control device analyzes a condition of the equipment and quality of the board with reference to warning criterion which do not exceed failure criterion, and then dynamically controls the various devices accordingly.
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申请公布号 |
US5564183(A) |
申请公布日期 |
1996.10.15 |
申请号 |
US19930129604 |
申请日期 |
1993.09.30 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
SATOU, KENICHI;KAWAI, MAKOTO;NAKAO, YOSHIFUMI;MASUDA, SATOSHI;KANEMATSU, KOICHI;HORIMOTO, SETSUO |
分类号 |
B23K31/12;G01R31/28;H05K3/12;H05K3/34;H05K13/08;(IPC1-7):H05K3/34;G06F19/00 |
主分类号 |
B23K31/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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