发明名称 Producing system of printed circuit board and method therefor
摘要 An assembly line includes a printing device for printing solder on a land of a circuit board, a mounting device for mounting an electric component at a predetermined position of the solder, and a soldering device for soldering the land to a terminal of the component. A monitored items detecting device detects predetermined to be monitored items of the board and equipment used in the printing, mounting, or soldering devices, and a control device analyzes a condition of the equipment and quality of the board with reference to warning criterion which do not exceed failure criterion, and then dynamically controls the various devices accordingly.
申请公布号 US5564183(A) 申请公布日期 1996.10.15
申请号 US19930129604 申请日期 1993.09.30
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 SATOU, KENICHI;KAWAI, MAKOTO;NAKAO, YOSHIFUMI;MASUDA, SATOSHI;KANEMATSU, KOICHI;HORIMOTO, SETSUO
分类号 B23K31/12;G01R31/28;H05K3/12;H05K3/34;H05K13/08;(IPC1-7):H05K3/34;G06F19/00 主分类号 B23K31/12
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