发明名称 Semiconductor treatment system and method for exchanging and treating substrate
摘要 A resist coating system for semiconductor wafers has a treatment unit and a transfer unit. The treatment unit has a plurality of treatment sections, and a transfer robot moves along the treatment sections. The transfer robot has a vertically movable driving block and first, and second and third arms for holding the semiconductor wafers, which are vertically arranged on the driving block and supported by the same such that they can advance and retreat independent of one another, and an adiabatic plate supported by the driving block between the third arm and the first and second arms. The third arm is used to take each wafer out of a cooling section, which is one of the treatment section. The wafer exchange in each treatment section is performed by means of two of the first through third arms. An arm for taking from the treatment section a wafer having been treated is operated in synchronism with another arm for inserting into the section a wafer to be treated.
申请公布号 US5564889(A) 申请公布日期 1996.10.15
申请号 US19940262329 申请日期 1994.06.17
申请人 TOKYO ELECTRON LIMITED;TOKYO ELECTRON KYUSHU LIMITED 发明人 ARAKI, SHINICHIRO
分类号 B65G49/07;H01L21/677;H01L21/687;(IPC1-7):B65G35/00 主分类号 B65G49/07
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