| 摘要 |
<p>PURPOSE: To dispense with the drill processing to a substrate and to facilitate high density mounting, in an image apparatus wherein a plurality of image arrays each having a large number of light detecting and emitting elements provided thereto are arranged on a substrate, by connecting individual electrode wirings and longitudinal wirings by viaholes and subjecting the LED arrays to flip chip connection. CONSTITUTION: Wirings 12, 14, 16, 18 are provided on the surface on a substrate 2 on both sides of the row of LED arrays 4 through insulating layers 20, 22, 24. The individual electrode wirings 12, 14 among the wirings are U-shaped wirings and provided in a unit of two LED arrays 4 and the LED arrays 4 are connected to the end parts of the respective wirings. The longitudinal wirings 16, 18 are connected to the individual electrode wirings 12, 14 through viaholes 26, 28. Pref., the respective bonding pads of the individual electrode wirings 12, 14 are provided on the substrate 2 so as to be arranged at the same height and the respective individual electrodes of the LED arrays 4 are connected thereto by flip chip connection.</p> |
