Base substrate of multichip module and method for inspecting the same

摘要

A plurality of bare semiconductor IC chips are mounted on a base substrate. The base substrate and IC chips are sealed in a package to constitute a multichip module. Diodes are disposed on the base substrate so that an end of each diode is connected to a terminal for connecting each IC chip with said base substrate and the other end thereof is connected to a prescribed voltage. As a result, it is possible to inspect the base substrate by contacting probes only with a connecting pad between the base substrate and a package, to reduce the number of pins of a probe card, to produce a cheap probe card and to reduce a rate of imperfect contact between the probe card and an inspecting pad.