| 摘要 |
PURPOSE: To polish a wafer without entailing any cut this wafer. CONSTITUTION: When an abrasive pad 14 is dressed by a diamond tool, diamond abrasive grains 5 drop in cavities 6 being scattered over a surface of this abrasive pad 14 and and are discharged out by dint of water jetting alone. In order to cope with this fact, a rotary roller 1 with a lot of aciculate resin 4 for mechanicallt springing out these diamond abrasive grains 5 like a brush and plural pieces of water jetting pipes 2 of nozzles 3 jetting pure water are installed, whereby the diamond abrasive grains 5 dropped out of the abrasive pad 14 are completely eliminable. |
