发明名称 Method of forming a groove in a semiconductor laser diode and a semiconductor laser diode
摘要 The disclosure describes a method of forming a groove in a structure of a semiconductor laser diode, which comprises a crystal growth procedure of epitaxial growth of a core layer comprising MP, wherein M represents one or more of elements belonging to group IIIb of periodic table and an upper layer comprising MAs, wherein M represents one or more of elements belonging to group IIIb of periodic table, successively on (100) surface of MAs crystals in a lower layer comprising MAs; a photolithography and wet etching procedure of, after forming an etching mask on the upper layer, forming an etching window to the etching mask; a first etching procedure of selective etching the upper layer; and a second etching procedure of selective etching other faces except for the face in which (111) face of MP crystals in the core layer is exposed.
申请公布号 US5566198(A) 申请公布日期 1996.10.15
申请号 US19950380836 申请日期 1995.01.30
申请人 MITSUBISHI CHEMICAL CORPORATION 发明人 HORIE, HIDEYOSHI;FUJIMORI, TOSHINARI;NAGAO, SATORU;HOSOI, NOBUYUKI;GOTO, HIDEKI
分类号 H01L33/00;H01S5/20;H01S5/22;H01S5/223;H01S5/227;(IPC1-7):H01S3/18 主分类号 H01L33/00
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