| 摘要 |
The binder removing apparatus in tantalum condenser molding device comprises a heating room at 190-200 deg.C, a binder removing room (3) in which there is L-shape cylinder (4) with couples of dish-type wings (5) to storing a refrigerant such as liquid nitrogen and a vacuum pump (6). The ambient temperature of the binder removing room is more than -11 deg.C and removal rate is more than 99%. |
