| 摘要 |
PURPOSE: To obtain an epoxy resin composition capable of reducing aluminum production and improving the reliability of current injection through a photosemiconductor containing aluminum as a component in the high- temperature and high-humidity environment. CONSTITUTION: At least one epoxy resin selected from bisphenol A-type, bisphenol F-type and alicyclic epoxy resins is incorporated with each specified amount of a phosphorus-based bromide curing promoter, amine-based curing promoter and mercaptosilane coupling agent and also incorporated with an acid anhydride curing agent at an equivalent ratio of 1.0-1.2 followed by curing at 100-120 deg.C for 5-15h to obtain the objective composition. |
