PRODUCTION OF OPTICAL WAVEGUIDE MODULE

摘要

PURPOSE: To provide a method for producing an optical waveguide module which obviates the peeling of optical waveguides during the course of production or use. CONSTITUTION: Both sides of the optical waveguides 5 of a waveguide chip 15 obtd. by forming the optical waveguides 5 on a substrate 4 and forming fitting guide grooves 8 on both sides holding the regions formed with the optical waveguides 5 therein are retreated. The upper side of the waveguide chip 15 is provided with a cap member 10 having the coefft. of thermal expansion and thickness nearly equal to the coefft. of thermal expansion and thickness of the waveguide chip 15. Guide cap grooves 14 are formed at the cap member 10 in the positions corresponding to the fitting guide grooves 8. After the cap member 10 is adhered to the waveguide chip 15, a release agent is applied on the front surface of the optical waveguides 5 before and behind the cap member 10 and thereafter, the parts exclusive of the optical waveguide connecting ends are covered with a covering member 18. The covering member 18 is provided with pin fitting holes 13 for connecting the waveguide chip inscribed with the fitting guide grooves 8 and the guide cap grooves 14.