| 摘要 |
<p>PURPOSE: To facilitate a change of a chip number, a change of a chip size, and an accurate chip alignment, when an electrical test is performed in a chip state. CONSTITUTION: A plurality of through holes 12 are provided in a polyimide film 11 having a constant thickness to be placed on a stage in a die-sort tester when a die-sort test is carried out. These through holes 12 are for fixing a semiconductor chip when a die-sort test is performed after a semiconductor device formed on a semiconductor wafer is subjected to dicing. The plane form of the hole 12 is the same as the plane form of the semiconductor chip. Therefore, a change of a chip number, a change of a chip size, and an accurate chip alignment are facilitated when an electrical test is performed in a chip state.</p> |
