| 摘要 |
PURPOSE: To prevent the moisture from penetrating to improve the durability and stabilize the performance by metal-plating the entire side face of a package to cover this side face with a metal layer. CONSTITUTION: Many signal lines 3 and ground lines 4 are formed on a cut resin substrate 2 and connected to signal electrodes and ground electrodes of an IC chip 6 while the other ends of them are exposed on the lower face of the substrate 2 with spacings. Connection terminals 8 are fixed to these exposed other ends. The IC chip 6 and its parts connected to the signal lines 3 and ground lines 4 are buried with sealing resin 2 in a package A1. The side face 1a of the package A1 is plated with a metal to form a metal layer 15 which covers this side face 1a. Thus, the side face of the package easy for the moisture to penetrate is covered to result in the improvement of the durability and stability of the performance. |
