| 摘要 |
<p>PURPOSE: To provide tweezers in which no dust is generated without damaging a wafer. CONSTITUTION: When the surface 2a of a holder 2 is brought into contact with a wafer and a suction operating unit 4a is operated in the direction of an arrow D, a movable unit 4b is moved in the direction of an arrow B. A wire 4d is moved in the opposite direction of an arrow C by the movement of the unit 4b, a film 1 is pulled and elongated, and as the part surrounded by the wafer, the film 1 and the holder 2 is increased, the wafer is sucked to the surface 2a of the holder 2.</p> |
