| 摘要 |
<p>PURPOSE: To obtain a method for forming bumps in which short circuit is prevented between adjacent plating layers in the case of plating. CONSTITUTION: After forming a plating layer 7 on each electrode pad 21, 22,... provided on a substrate 1, a first plating layer 9 is formed on the upper surface of a plating layer 7 of every other electrode pad 21, 23 in the first step. In the second step, a second resist pattern 10 is formed on the substrate 1 while covering the first plating layer 9 but exposing the upper surface of the plating layer 7 applied with no first plating layer 1 before a second plating layer 11 is formed using the second resist pattern 10 as a mask. In the third step, reflow is effected after removing each resist pattern and a bump 12a is formed by shaping the plating layer 7 and the first plating layer 9 on the electrode pads 21, 23 while a bump 12b is formed by shaping the plating layer 7 and the second plating layer 11 on the electrode pads 21, 23.</p> |
