发明名称 LEAD FRAME FOR SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PURPOSE: To obtain a lead frame which can fix a mounted board immovably. CONSTITUTION: A lead frame is equipped with a bed part whereon a board 12 is mounted and with leads 10 provided radially around the bed part. While various signal lines are allotted to these leads 10, a number of leads are left unused. The leads 10 to which signals are allotted are separated at a prescribed distance from the board 12, since the contact thereof with the board 12 causes a short-circuiting of a circuit. On the other hand, the unused leads 10a (hereinafter called board-fixing leads) can be extended to the vicinity of the board 12, since they cause no short-circuiting of the circuit even when they come into contact with the board 12. By providing the board-fixing leads 10a in prescribed numbers, consequently, the board mounted on the lead frame can be fixed immovably.
申请公布号 JPH08264707(A) 申请公布日期 1996.10.11
申请号 JP19950063646 申请日期 1995.03.23
申请人 TOYOTA MOTOR CORP 发明人 TAKATANI HIDESHI
分类号 H01L23/50 主分类号 H01L23/50
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