| 摘要 |
<p>PURPOSE: To enable a multilayer ceramic board to be improved in interlayer adhesion and protected against delamiantion or cracking by a method wherein a part of the ceramic board provided with no inner electrode pattern is set equal or approximate to the rate of thickness change caused by the pressure applied to another part of the ceramic board provided with an inner electrode patten. CONSTITUTION: A thickness compensator 9 is formed of the same insulating material with a thick ceramic green sheet 5, used for compensating for the height equivalent to the thickness of the inner electrode conductor pattern 2 of a thin ceramic green sheet 3, and provided to the peripheral surface edge of the thick ceramic green sheet 5. A part of the ceramic green sheet laminate provided with no inner electrode conductor pattern 2 is set equal or approximate by the thickness compensators 9 to the rate of thickness change caused by the pressure applied to another part of the ceramic green sheet laminate provided with the inner electrode conductor patten 2. Therefore, the part of the ceramic green sheet laminate provided with no inner electrode conductor pattern 2, where no pressure is applied due to that it has no inner electrode conductor pattern 2, a prescribed rate of thickness change is not obtained, and delamination or cracking is liable to occur, is changed in thickness as prescribed by providing the thickness compensators 9.</p> |
