| 摘要 |
PURPOSE: To perform wiring freely in an SLC layer by maintaining the conductor path securing function of a through hole, which is electrically connected to a solder ball located at the opposite surface of the electrode of a semiconductor chip mounted on a multilayer substrate. CONSTITUTION: An SLC layer 13, which is provided on the first surface of a multilayer substrate, is connected to a conductor path 25 provided in a through hole 5 whose inside is filled and electrically connected to a solder bump 22 provided on the opposite surface of the first surface through the conductor path 25. Therefore, the distance of the wiring length between the connecting terminal of a substrate chip and the solder bump can be shortened, and thus the noises can be decreased. At the same time, since the mounting distance between the chips can be shortened, the fact contributes to high integration degree. Furthermore, since the wiring of the SLC layer 13 is not blocked by the presence of the through hole, the freedom of the wiring design can be secured. |
