| 摘要 |
PURPOSE: To ensure sealing between a semiconductor chip and an auxiliary wiring board piece by adopting a method such as to provide a sealing resin layer to a surface of an auxiliary wiring board piece opposite to a surface at the side of an electrode of a semiconductor chip. CONSTITUTION: A sealing resin layer 3 is provided in advance to a surface excepting an inside electrode 22 at the side of the inside electrode 22 of an auxiliary wiring board piece 2 with a wiring pattern consisting of an inside electrode 22 connected to an electrode 41 of a semiconductor chip 4, an outside electrode 23 connected to a conductor end of a mounting circuit board and a routing conductor 21 extending between the electrodes 22, 23. The electrode 41 of the semiconductor chip 4 is connected to the inside electrode 22 of the auxiliary wiring board piece 2 and a surface at the side of the electrode 41 of the semiconductor chip 4 is fused to a sealing resin layer 3. For example, the auxiliary wiring board piece 2 has insulation layers 11, 12 holding the routing conductor 21 therebetween and is prepared by using a plastic tape base. It is desirable to form the sealing resin layer 3 by using thermally fusing polyimide. |
