发明名称 PROCESSING METHOD AND PROCESSING DEVICE
摘要 PURPOSE: To perform the setting and the resetting of a semiconductor wafer from a cassette in an optimum attitude and efficiently to perform processings procedure, in a processing device that performs photoresist film application and development of the semiconductor wafer. CONSTITUTION: Un processed wafers WB contained in a cassette 122 provided in a transfer mechanism 120 are picked up one by one by use of a pair of tweezers 121 of a moving mechanism, and set/reset by use of two pairs of tweezers 112, 113 into processing stations thermally insulated and arranged on both sides of a transfer path 102. The pairs of tweezers are movable in the longitudinal, lateral and vertical directions and rotatable, namely movable in four directions. The wafers WB are centered and aligned to set/reset, assuming an optimum posture. The products are free of change in shape and quality, and foreign matters.
申请公布号 JPH08264621(A) 申请公布日期 1996.10.11
申请号 JP19950302222 申请日期 1995.10.27
申请人 TOKYO ELECTRON LTD;TOKYO ELECTRON KYUSHU KK 发明人 USHIJIMA MITSURU;AKUMOTO MASAMI;HIRAKAWA OSAMU;KIMURA YOSHIO
分类号 G03F7/16;B05C11/08;B65G49/07;G03F7/20;H01L21/027;H01L21/677;(IPC1-7):H01L21/68 主分类号 G03F7/16
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